http://www.FEA-Forums.com/ FEA Forums » Forum: COMSOL News - Recent Posts en Tue, 07 Feb 2012 22:54:49 +0000 http://www.FEA-Forums.com/topic/12#post-37 Thu, 13 Mar 2008 17:43:09 +0000 NEiNastran 37@http://www.FEA-Forums.com/ <p>Here is a link to Noran Engineering Multiphysics Products:<br /> <a href="http://www.nenastran.com/newnoran/lsdyna" rel="nofollow">http://www.nenastran.com/newnoran/lsdyna</a> </p> http://www.FEA-Forums.com/topic/22#post-27 Tue, 06 Nov 2007 06:57:36 +0000 admin 27@http://www.FEA-Forums.com/ <p>Simpleware Ltd. and COMSOL Inc. announced today at the COMSOL Users Conference 2007 in Grenoble a partnership agreement to provide an export interface from Simpleware's world-leading 3D image-based meshing software +ScanFEâ„¢ to COMSOL Multiphysics® 3.4, the industry's foremost multiphysics simulation environment. The +ScanFE interface enables COMSOL users to directly import high-quality meshes generated from MRI, CT, and MicroCT scan data into COMSOL Multiphysics 3.4 for modelling and simulation without requiring re-meshing or pre-processing. </p> <p>"We are striving to provide best-in-class software solutions for all design, simulation, and product development needs" said Philippe Young, MD of Simpleware. "The partnership with COMSOL will further enhance our position as the leading provider of tools for the conversion of 3D images to simulation models". </p> <p>A key component of Simpleware’s suite of image-processing solutions, +ScanFE provides a powerful suite of algorithms and a robust toolset for converting segmented 3D image data into multi-part volumetric models. +ScanFE generates high-quality volume and surface meshes, contact surfaces, and material properties from the segmented data, all of which can now be directly exported to COMSOL Multiphysics. </p> <p>Simpleware's new Export to COMSOL Multiphysics functionality is a simple two-step operation. First, ScanIPâ„¢ segments the regions of interest from the scan data, and then +ScanFE generates an input file for COMSOL Multiphysics. Once you import the file, you can leverage COMSOL to model, simulate, and to design biomedical applications such as hip joint replacements, vascular therapy, and drug delivery. </p> <p>"The ability to create multiphysics models from MRI and CT data is something that many of our biomed and bioengineering users have demanded", said Ed Fontes, VP of Applications at COMSOL. "This new cooperation with Simpleware places COMSOL Multiphysics on the leading edge of biomedical and bioengineering modelling, design, and simulation". </p> <p>The combination of Simpleware's +ScanFE and COMSOL provides users across the biomechanics and materials science disciplines with an indispensable tool. Key benefits of the +ScanFE and COMSOL Multiphysics partnership include: </p> <p>The unique ability to create meshes from 3D scan data, such as MRI, CT and MicroCT, and directly make them available for true multiphysics simulations without intermediate steps such as re-meshing and pre-processing.<br /> The possibility to integrate CAD and image data interactively, and then automatically mesh the resulting combined model. Users can insert implants and blood stents into the original scan data and then run simulations involving complex interactions between implant, tissue, and blood.<br /> The capability to reconstruct and mesh separate parts yielding perfectly conforming interfaces (no gaps or overlaps). The properties and physics of the different parts and the interactions across the interfaces can be fully manipulated in the model set-up.<br /> The capacity for users to access application examples and exercises that lead them through the entire process from acquiring and exporting 3D scan data to full multiphysics modelling of complex geometries with multiple parts. </p> <p>About COMSOL<br /> COMSOL Multiphysics® is a scientific-software environment for the modelling and simulation of any physics-based system. A particular strength is its ability to account for multiphysics phenomena. Optional modules add discipline-specific tools for chemical engineering, earth science, electromagnetics, heat transfer, MEMS, and structural mechanics. Other products include COMSOL Reaction Engineering Lab®, which allows users to model reacting systems; and COMSOL Scriptâ„¢, a MATLAB®-compatible programming language that works both as a general-purpose scientific computational tool and provides a textual based interface to COMSOL Multiphysics models.<br /> For more information on COMSOL, visit: <a href="http://www.comsol.com" rel="nofollow">http://www.comsol.com</a> </p> <p>About Simpleware<br /> Simpleware provides and develops world-leading mesh generation software for the conversion of 3D scan data (e.g. MRI, CT, MicroCT, etc.) into high-quality computer models used for CAD, Finite Element simulation, and Rapid Prototyping. The ease and unprecedented accuracy with which models can be generated have opened up computational analysis (FEA and CFD) and rapid prototyping to a variety of research fields, including: Industrial Reverse Engineering, Implant Design and other Biomedical Engineering fields, Materials Research, Palaeontology, Forensics, and Biomimicry. Simpleware provides what is effectively a 3D photocopier: three-dimensional replicas can be generated automatically based on scans. In parallel, computer simulations can be used to assess the suitability or performance of objects in operation. Unlike other approaches, Simpleware provides a complete software solution, and enables users to produce models in a fraction of the time taken with alternative software.<br /> For more information on Simpleware, visit: <a href="http://www.simpleware.com" rel="nofollow">http://www.simpleware.com</a> </p> http://www.FEA-Forums.com/topic/21#post-26 Tue, 06 Nov 2007 06:56:39 +0000 admin 26@http://www.FEA-Forums.com/ <p>Major upgrade features multicore support, new solvers, and enhancements to discipline-specific modules. </p> <p>BURLINGTON, MA (October 5, 2007) - COMSOL, Inc. announces COMSOL Multiphysics® 3.4, a major release of its industry-leading engineering and scientific software environment for modeling and simulating any physics-based system. New multicore processor support, key to version 3.4, provides engineers and scientists unprecedented performance, solver speed, and accuracy in multiphysics simulations. In addition to applying parallel computing throughout the solution process, COMSOL Multiphysics 3.4 introduces new fluid dynamic solver methods for simulating very large problems in chemical engineering, heat transfer, or microfluidics applications and sees significant enhancements throughout its suite of discipline-specific modules for such specialized simulations as chemical engineering, RF, reaction engineering, and structural mechanics. COMSOL Multiphysics 3.4 makes its public debut today at the 2007 COMSOL Conference in Boston, where it will be on display through October 6. COMSOL Multiphysics 3.4 is available directly from COMSOL, Inc. or from COMSOL distributors worldwide immediately.</p> <p>Multicore processing slashes time to solution<br /> COMSOL Multiphysics 3.4 delivers the utmost in computational speed by leveraging multicore processors and shared-memory parallelism. Every step of the simulation workflow—meshing, assembly, and solving—now executes in parallel. COMSOL Multiphysics 3.4 will use the maximum number of cores available on the system, and users have complete control over the number of processors dedicated to their simulations.</p> <p>Thermal-structural-electromagnetics multiphysics coupling in a microwave circulator. Studies run by Professor Darrell Pepper and his group at the University of Nevada, Las Vegas, compared COMSOL with a number of other FEA-based simulation tools in a range of multiphysics applications. “For the circulator problem, considering the finite-element schemes and comparable mesh size,” Dr. Pepper reports, “COMSOL Multiphysics runs three times faster than another specialized FEA-based electromagnetics software.”</p> <p>COMSOL Multiphysics 3.4 provides fully parallelized meshing for assemblies straight out of the box. A new boundary layer meshing feature in version 3.4 enables users to mesh thermal boundary layers, charged double-layers in AC/DC applications, or viscous boundary layers in fluid-flow applications more efficiently, with greater accuracy, and with less memory consumption than previously possible.</p> <p>A major upgrade to COMSOL Multiphysics’s iterative methods pushes solver performance for fluid dynamics to new heights. For example, new, state-of-the-art Galerkin Least Squares (GLS) stabilization techniques now complement COMSOL’s iterative solvers, enabling engineers and scientists to compute large fluid flow problems with millions of degrees of freedom. A segregated solver with an easy-to-use interface, new in version 3.4, reduces memory consumption significantly when computing large problems, such as fluid-structure interaction (FSI) or wave propagation in thermally deformed structures. When compared to its predecessors, COMSOL Multiphysics 3.4 solves fluid-flow problems up to five times faster.</p> <p>COMSOL Multiphysics 3.4 also offers users a new suite of postprocessing tools for computing geometric properties such as volume, area, center of gravity, and moment of inertia. Even simulation results can be presented in exciting new ways with version 3.4’s expanded palette of color scales.</p> <p>Multiphase flow and free convection in the Chemical Engineering and Heat Transfer Modules Users of the COMSOL Chemical Engineering and Heat Transfer Modules can now step up their simulations to include variable-density flow and free convection. Engineers will find these new capabilities particularly useful when solving coupled flow and conjugate heat transfer problems commonly encountered in electronic cooling and heat exchanger analyses. For applications such as microfluidics, multi-species convection, and reacting flows, COMSOL Multiphysics 3.4 has been enhanced with additional multiphysics modeling interfaces for turbulent and laminar flow with variable densities due to variations in composition.</p> <p>The Chemical Engineering Module has been improved with a powerful modeling interface for the simulation of multiphase flow. With it, users can now simulate bubbly flows such as in scrubbers, aerators, bioreactors, and food-processing equipment effortlessly. Users can also easily set up mixture models for simulating emulsification, sedimentation, and other separation processes common in the chemical, pharmaceutical, and food-processing industries.</p> <p>The Heat Transfer Module has been greatly enhanced by the introduction of boundary layer meshing and by improvements to COMSOL’s solver technology. Boundary layer meshing provides engineers and scientists with greater accuracy yet requires fewer elements for simulating electronic cooling, heat exchangers, and heat losses to solid structures in mechanical design. Also new in the Heat Transfer Module is the ability to model 3D surface-to-surface radiation using the memory-saving 2D axisymmetric modeling domain.</p> <p>Parameter estimation in COMSOL Reaction Engineering Lab<br /> Upgrades to the COMSOL Reaction Engineering Lab® include a powerful new interface for running nonlinear parameter estimations on multiple sets of experimental data. In addition, it is now possible to select which parameters to estimate and which parameters to keep constant in each estimation run. Outputs now display with confidence intervals and standard deviations.</p> <p>SPICE import in the AC/DC Module and new lumped ports in the RF Module<br /> Version 3.4 makes it easy to build and run COMSOL models as part of SPICE-based circuit simulations thanks to the AC/DC Module’s new SPICE user interface. Another exciting new feature for electronics, electrical components, geophysics, and electrochemistry applications is small-signal analysis for AC impedance studies. Users can also easily model electric motors and generators through a new interface supporting periodic boundary conditions and sector symmetry. Additionally, a new periodic boundary condition user interface has been introduced in the RF Module along with an improved interface for lumped port boundary conditions, which is ideal for wave propagation in transmission lines and circuit boards.</p> <p>Fatigue analysis enhances the Structural Mechanics Module<br /> The COMSOL Multiphysics Structural Mechanics Module now lets users predict high- and low-cycle fatigue damage. A suite of COMSOL Script functions calculate fatigue damage from inputs made up of loading data and deterministic, stochastic, or even nonproportional material fatigue data.</p> <p>COMSOL Multiphysics 3.4 Highlights<br /> Parallelized meshing, assembly, and solving on multicore and multiprocessor computers<br /> Memory-efficient fluid flow solvers for chemical engineering, heat transfer, and microfluidics Segregated solver minimizes memory consumption for large multiphysics problems Improved postprocessing including geometric properties such as center of gravity Easy modeling of electronics cooling and free convection with interfaces for variable-density flow Boundary layer meshing for representing boundary layers in fluid flow, heat transfer, and electromagnetics Bubbly flow interfaces for modeling of scrubbers, aerators, bioreactors, food processing equipment, and boiling Mixture-model two-phase flow interfaces for simulation of emulsification, sedimentation and separation processes as well as fluidized beds Nonlinear parameter estimation<br /> Piezoacoustic multiphysics modeling of microphones, ultrasonic transducers and MEMS devices Full-wave 3D RF analysis of printed circuit boards and transmission lines with lumped port boundary conditions Fatigue analysis </p> <p>Availability<br /> COMSOL Multiphysics 3.4 runs on Windows, Linux, Solaris, and the Macintosh workstations with a minimum of 1GB of memory. COMSOL Multiphysics 3.4 is available directly from COMSOL and from COMSOL’s global network of distributors immediately. Pricing starts at $7,995 (U.S.).</p> <p>For more information about COMSOL Multiphysics 3.4, all discipline-specific technology modules, and detailed system requirements, or to sign up for an introductory CD, visit COMSOL Inc. at <a href="http://www.comsol.com" rel="nofollow">http://www.comsol.com</a>.</p> <p>About the COMSOL product line<br /> COMSOL Multiphysics is a scientific-software environment for the modeling and simulation of any physics-based system. A particular strength is its ability to account for multiphysics phenomena. Optional modules add discipline-specific tools for chemical engineering, earth science, electromagnetics, heat transfer, MEMS and structural mechanics. Other products include COMSOL Reaction Engineering Lab®, which allows users to model reacting systems; and COMSOL Scriptâ„¢, a MATLAB compatible programming language that works both as a general-purpose scientific computational tool and provides a textual based interface to COMSOL Multiphysics models. The COMSOL products are available for the Windows, Linux, Solaris, and the Macintosh operating systems. Full details about COMSOL Multiphysics and related products are available at <a href="http://www.comsol.com" rel="nofollow">http://www.comsol.com</a>.</p> <p>About the COMSOL Group<br /> COMSOL was founded in 1986 in Stockholm, Sweden, and has grown to include offices in the Benelux, Denmark, Finland, France, Germany, Italy, Norway, Switzerland, the United Kingdom, and a US presence with offices in Burlington, MA, Los Angeles, CA, and Palo Alto, CA. Additional information about the company is available at <a href="http://www.comsol.com" rel="nofollow">http://www.comsol.com</a> </p> <p>COMSOL, COMSOL Multiphysics, COMSOL Reaction Engineering Lab and FEMLAB are registered trademarks of COMSOL AB. COMSOL Script is a trademark of COMSOL AB. MATLAB is a registered trademark of The MathWorks, Inc. Other products or brand names are trademarks or registered trademarks of their respective holders. </p> http://www.FEA-Forums.com/topic/12#post-17 Mon, 24 Sep 2007 07:08:07 +0000 admin 17@http://www.FEA-Forums.com/ <p>BURLINGTON, MA (September 7, 2007)— The multiphysics community will gather in Newton, MA, to marvel at the latest developments in simulation programs and the wide range of applications that scientists and engineers can tackle with such powerful tools. On October 4-6, 2007, COMSOL is hosting this annual conference, which is sponsored by NASA Tech Briefs, MatWeb, Microwave Journal, Desktop Engineering, ACES and CEP. The conference is dedicated to the latest developments in multiphysics modeling, simulation, and virtual prototyping. The organizers have put together a comprehensive program that covers many facets of this technology. It includes 7 keynote speeches, 80 contributed papers, poster sessions, minicourses, roundtable discussions, demo stations where users can get first-hand detailed explanations of the latest capabilities of modeling software, and an exhibition area for related products and services</p> <p>This US conference leads off a worldwide series of similar meetings around the world including one in Grenoble, France, followed by meetings in Taipei, Kuala Lumpur, Shanghai, Beijing, Singapore, Seoul, and Tokyo. In each one, scientists and engineers will gather in a cross-disciplinary forum that allows them to exchange their expertise and experiences with modeling techniques and learn from each other as well as COMSOL experts. Not only do the attendees and speakers represent a broad range of industries, they come from every branch of academia, government labs, and commercial organizations and so can benefit from users’ experiences across industries. Further, a program committee reviewed all paper submissions to ensure that those presented at the conference have the highest quality and relevance to the multiphysics user community.</p> <p>Keynote Presentations<br /> A highlight of the US conference will consist of keynote speeches given by users of COMSOL. Joining several COMSOL executives in this role are:</p> <p> * Dr. John Tanski of Los Alamos National Laboratory, who has worked on projects including process analysis of steel operations, multiphase flow modeling, and modeling material aging in strategic systems.<br /> * Dr. Claudio Parazzoli of the Boeing Phantom Works, whose current interests are negative-index materials, direct thermal-to-electrical energy conversion, and quantum optics.<br /> * Dr. Darrell Pepper, Director of the Nevada Center for Advanced Computational Methods at the University of Nevada Las Vegas. He has co-authored several textbooks on the finite element method and the boundary element method.<br /> * Jim Knox of the NASA Marshall Space Flight Center, who is the technical manager of the Sorbent-Based Atmosphere Revitalization project, developing CO2 and H2O removal systems for manned space missions.<br /> * Ronald Gamache of TransTech Systems Inc, who is responsible for the development of electromagnetic sensing solutions in material characterization problems.</p> <p>As this list indicates, the conference will cover multiphysics aspects of a wide range of applications such as acoustics, chemical engineering, electromagnetics, fluid dynamics, heat transfer, and structural mechanics. Conference themes also include emerging technologies such as biotechnology, MEMS, nanotechnology, and optoelectronics.</p> <p>For detailed information and registration for the US conference or any of the international conferences, go to <a href="http://www.comsol.com/conference2007" rel="nofollow">http://www.comsol.com/conference2007</a>.</p> <p>Note to editors: Members of the press are invited to attend the conference at no charge. Please contact Bernt Nilsson <a href="mailto:bernt@comsol.com">bernt@comsol.com</a> for information and free registration.</p> <p>About the COMSOL product line</p> <p>COMSOL Multiphysics® is a scientific-software environment for the modeling and simulation of any physics-based system. A particular strength is its ability to account for multiphysics phenomena. Optional modules add discipline-specific tools for chemical engineering, earth science, electromagnetics, heat transfer, MEMS, and structural mechanics. Other products include COMSOL Reaction Engineering Lab®, which allows users to model reacting systems; and COMSOL Scriptâ„¢, a MATLAB®-compatible programming language that works both as a general-purpose scientific computational tool and provides a textual based interface to COMSOL Multiphysics models. The COMSOL products are available for the Windows, Linux, Solaris, and the Macintosh operating systems. Full details about COMSOL Multiphysics and related products are available at <a href="http://www.comsol.com" rel="nofollow">http://www.comsol.com</a>.</p> <p>About the COMSOL Group</p> <p>COMSOL was founded in 1986 in Stockholm, Sweden, and has grown to include offices in the Benelux, Denmark, Finland, France, Germany, Italy, Norway, Switzerland, the United Kingdom, and a US presence with offices in Burlington, MA, Los Angeles, CA, and Palo Alto, CA. Additional information about the company is available at <a href="http://www.comsol.com" rel="nofollow">http://www.comsol.com</a>.</p> <p>COMSOL, COMSOL Multiphysics, COMSOL Reaction Engineering Lab, and FEMLAB are registered trademarks of COMSOL AB. COMSOL Script is a trademark of COMSOL AB. MATLAB is a registered trademark of The MathWorks, Inc. SolidWorks is a registered trademark of SolidWorks Corporation. MatWeb is a trademark of Automation Creations. Other products or brand names are trademarks or registered trademarks of their respective holders. </p>